Via Plugging layers by via type, via location,
and by layer.
• Create tenting and plugging layers at the
end of design process, after all routing
and placement decisions are complete.
• Tent all vias or just the ones under the
BGA's automatically.
• Plug via in pad, and / or Tangential vias,
and / or testpad vias, and /or all vias.
• Tent QFN/QFP thermal vias without
updating the symbol.
• Use the "Plug Opposite" option for low
cost plugging manufacturing processes.
• User definable Tangential via gap.
• Create plugging pads same size as the via
pad or via drill.
• Works in both metric and imperial units
of measure.
